3D FingerVein sensor 1.0

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Product Brief:

A low cost 3D-FVB sensor device. This device will be adapted to the context of developing countries without compromising on performance and quality. It will contain a communication module for secure transfer of 3D-FVB data to secure central servers. The sensor device will be very robust requiring minimal maintenance, resistant to high temperatures (around 60°C), humidity (100%) and dust, and will have enough autonomy using battery and / or solar power.


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